Thin Film Bulge Test of Nanocrystalline Metals
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چکیده
Free-standing nanocrystalline copper (Cu) films with grain size around 39 nm are fabricated by thermal evaporation and characterized by the plane-strain bulge test. Young’s modulus and yield stress at a 0.2% offset are about 110 ~ 130 GPa and 400 MPa, respectively. Results show that no grain growth is observed and the predominant plastic deformation mechanism is grain boundary sliding accompanied by dislocation mechanisms within the grains to accommodate grain boundary sliding.
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تاریخ انتشار 2008